Product Overview & Core Technology
CYCLOTENE™ photosensitive dielectric series are premier high-reliability polymers engineered for advanced semiconductor packaging and high-frequency (RF / 5G / 6G) applications, combining ultra-low dielectric constant with exceptionally low moisture absorption.
CYCLOTENE™ BCB Key Performance Metrics
Benchmark vs. Conventional Polyimide (PI)
Dielectric Const. (Dk @1~20GHz)
2.65
22% lower than PI (3.4) (Minimizes RC Delay)
Dissipation Factor (Df @1~20GHz)
0.0008
1/10th of PI (0.01) (Ultra-Low Signal Loss)
Water Absorption (Moisture)
< 0.2%
Prevents dielectric drift from moisture
Thermal Stability (Tg)
> 350 °C
Lead-free solder reflow compatible
4000 & 6800 Series Highlights
- Low Dielectric Constant (Dk): 2.65 across wide broadband (1 GHz - 20 GHz)
- Ultra-Low Dissipation Factor (Df): 0.0008 for maximum RF / high-speed signal integrity
- 6800 Series: High resolution (~1.5:1 Aspect Ratio), standard 2.38% TMAH alkaline developer compatible
- Superior Thermal Stability: Tg > 350 °C / Ultra-low moisture absorption (< 0.2%)
CYCLOTENE™ XP-80 (Self-priming)
- Self-Priming Chemistry: Eliminates separate AP3000 adhesion promoter pre-treatment step
- Low Temperature Curable (200 °C): Significantly mitigates substrate thermal stress and warpage
- High-Frequency Optimization: Ultra-low loss dielectric for high-speed signal transmission
- Process Compatibility: PGMEA developer support
Photo-BCB Series Product Comparison & Process Specs
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| Series | Tone / Developer System | Cure Temperature | Key Features & Thickness Range |
|---|---|---|---|
| 4000 Series | Negative / Solvent-based (DS2100/3000) | 250 °C | Low Dk/Df, 0.8 µm - 30 µm film thickness |
| 6800 Series | Negative / 2.38% TMAH Aqueous | 210 - 250 °C | High resolution (~1.5:1 AR), standard TMAH develop |
| XP-80 | Negative / PGMEA | 200 °C (Low-Temp) | Self-priming, 200°C cure, ultra-low loss |
Target Applications
Advanced Packaging & RDL
- Fan-Out Wafer Level Packaging (FOWLP) redistribution layer (RDL) dielectric
- 2.5D / 3D IC interposer dielectric layers
- Wafer passivation and stress buffer coatings
High-Frequency RF & Photonics
- 5G / 6G mmWave RF front-end module dielectric
- GaAs, InP compound semiconductor surface passivation
- MEMS device capping and encapsulation structures
Technical Inquiry & Sample Request: Photo BCB (4000/6800/XP-80)
Get in touch with our technical sales engineers for datasheets, process guidelines, and sample evaluations.