Product Overview & Core Technology
CYCLOTENE™ 3000 & 3300 series are non-photosensitive BCB resins engineered for 3D-IC, permanent and temporary wafer bonding, and TSV applications. The 3300 series incorporates built-in self-priming chemistry, eliminating the separate AP3000 primer coating step.
CYCLOTENE™ BCB Key Performance Metrics
Benchmark vs. Conventional Polyimide (PI)
Dielectric Const. (Dk @1~20GHz)
2.65
22% lower than PI (3.4) (Minimizes RC Delay)
Dissipation Factor (Df @1~20GHz)
0.0008
1/10th of PI (0.01) (Ultra-Low Signal Loss)
Water Absorption (Moisture)
< 0.2%
Prevents dielectric drift from moisture
Thermal Stability (Tg)
> 350 °C
Lead-free solder reflow compatible
CYCLOTENE™ 3000 Series
- Broad Process Window: Wide curing and processing margin, selective HF vapor etch support
- Comprehensive Viscosity Range: 3022-35 (14cSt), 3022-46 (52cSt), 3022-57 (259cSt), 3022-63 (870cSt)
- Superior Planarization: Degree of Planarization >90% and thermal stability >350 °C
- Low Residual Stress: Minimizes wafer bow and thermal mismatch stress
CYCLOTENE™ 3300 Series (Self-priming)
- Self-Priming Innovation: Direct coating on substrates without separate AP3000 primer step
- Hybrid Bonding Optimized: Tailored for polymer hybrid bonding and wafer-level bonding
- Consistent Properties: Maintains identical Dk (2.65), Df (0.0008), and high shear strength
- Tact Time Reduction: Streamlines packaging cycle times and increases manufacturing yield
CYCLOTENE™ 3000 Viscosity vs. Thickness Specifications
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| Product Code | Viscosity (@25°C) | Coating Thickness Range | Primary Target Applications |
|---|---|---|---|
| 3022-35 | 14 cSt | 1.0 - 2.4 µm | Ultra-thin planarization & inter-level dielectric |
| 3022-46 | 52 cSt | 2.4 - 5.8 µm | Wafer bonding & medium-thickness insulation |
| 3022-57 | 259 cSt | 5.7 - 15.6 µm | Thick-film passivation & deep topography planarization |
| 3022-63 | 870 cSt | 9.5 - 26.0 µm | 3D-IC thick bonding layer & TSV encapsulation |
3D-IC & Bonding Applications
Wafer-to-Wafer (W2W) Bonding
Delivers void-free, highly uniform permanent bonding interfaces under thermal compression, offering exceptional adhesion strength and low defect density.
TSV & Polymer Hybrid Bonding
Optimized for heterogeneous 3D integration where Cu-Cu direct interconnects and polymer dielectric bonding are achieved concurrently.
Technical Inquiry & Sample Request: 3D-IC BCB (3000/3300)
Get in touch with our technical sales engineers for datasheets, process guidelines, and sample evaluations.