Product Overview & Core Technology
CYCLOTENE™ DF6800 & DF6800M series represent cutting-edge BCB-based photosensitive dielectric dry films (Dry Film Photo-Imageable Dielectric, DF-PID) developed specifically for Glass Core Substrates, Fan-Out Panel Level Packaging (FOPLP), and Embedded Die Substrates.
CYCLOTENE™ BCB Key Performance Metrics
Benchmark vs. Conventional Polyimide (PI)
Dielectric Const. (Dk @1~20GHz)
2.65
22% lower than PI (3.4) (Minimizes RC Delay)
Dissipation Factor (Df @1~20GHz)
0.0008
1/10th of PI (0.01) (Ultra-Low Signal Loss)
Water Absorption (Moisture)
< 0.2%
Prevents dielectric drift from moisture
Thermal Stability (Tg)
> 350 °C
Lead-free solder reflow compatible
Primary Applications
- Glass Core Substrate: TGV (Through Glass Via) filling (100 µm diameter / 400 µm depth) & multi-layer 6L-RDL build-up
- FOPLP Panel Packaging: Large panel (650x650 mm+) vacuum lamination with ultra-fine planarization
- Embedded Die Substrate: Void-free complete filling of deep trenches and cavities
Key Technical Specifications
- Tone / Developer: Negative / 2.38% TMAH standard aqueous alkaline developer
- High Resolution: ~2:1 Aspect Ratio ultra-fine via patterning
- High Throughput: Optimized exposure dose and fast develop speed for cost efficiency
- Ultra-Low Loss Properties: Preserves Dk (2.65) / Df (0.0008) electrical performance
DF6800 Dry Film Process Advantages vs. Liquid Resins
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| Process Step | DF6800 Dry Film Advantages vs. Conventional Liquid Resins |
|---|---|
| Lamination | Uniform thickness control across large panels (650x650 mm) via vacuum roll/press with zero edge bead formation |
| Via Patterning | Vertical sidewall profiles with standard 2.38% TMAH alkaline developer |
| TGV & Cavity Filling | Superior polymer flowability delivers 100% void-free filling inside TGVs and deep cavities |
Technical Inquiry & Sample Request: DF6800 (BCB DF-PID)
Get in touch with our technical sales engineers for datasheets, process guidelines, and sample evaluations.