Product Overview & Thermal Solutions
Global Laird high-performance Thermal Interface Materials (TIM) efficiently dissipate heat from semiconductor packages, telecom base stations, automotive ECUs, and battery systems to heatsinks, optimizing operational performance and longevity.
1. Laird Tputty™ (1.8 ~ 10 W/m·K)
- Thermal Conductivity (1.8 - 10 W/m·K): Dispensing putty for ultra-low stress tolerance gap filling
- Micro-Gap Conformability: Completely absorbs component height variations and surface roughness
- Automated Dispensing: Compatible with high-speed automated dispensing systems for volume production
- Long-Term Reliability: Zero drying, zero hardening, and excellent shape retention through thermal cycling
2. Laird Tflex™ & Tpcm™
- Laird Tflex™ (2.0 - 9.2 W/m·K): Soft Gap Pad sheets providing electrical insulation and thermal cushioning
- Laird Tpcm™ (1.5 - 7.5 W/m·K): Phase change materials (PCM) for direct CPU / GPU die thermal transfer
- Anti-Pump-Out & Rework: Resists oil bleeding, pump-out, and enables easy disassembly / rework
Laird Thermal Interface Materials Lineup Comparison
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| Product Series | Form Factor | Thermal Conductivity Range | Primary Target Applications |
|---|---|---|---|
| Laird Tputty™ | Dispensing Thermal Putty | 1.8 ~ 10 W/m·K | Irregular gap PCBs, telecom RF modules, automotive ECUs |
| Laird Tflex™ | Soft Gap Pad Sheet | 2.0 ~ 9.2 W/m·K | Memory modules, graphics cards, power supplies |
| Laird Tpcm™ | Phase Change Material (PCM) | 1.5 ~ 7.5 W/m·K | High-performance CPU/GPU direct die thermal interface |
Technical Inquiry & Sample Request: Laird Thermal Solutions
Get in touch with our technical sales engineers for datasheets, process guidelines, and sample evaluations.