Product Overview & Interfacial Adhesion Mechanism
DuPont™ Cyclotene™ Adhesion Promoters (AP3000 & AP8000) are ultra-high purity organosilane primer solutions formulated to maximize molecular adhesion between Cyclotene™ BCB resins, semiconductor substrates (Al, Cu, Ti, SiO2, SiNx, Glass), and packaging molding compounds.
Following standard bake processing, these primers maintain ASTM 5B maximum adhesion reliability even after 96-hour Pressure Cooker Testing (PCT: 121°C / 2 atm / 100% RH). They are also widely adopted to enhance interfacial adhesion and prevent delamination between Epoxy Molding Compounds (EMC), Underfills, and substrates in advanced packaging.
AP3000 (Vinyl-Functionalized Silane)
- Compatible Substrates: Universal adhesion to Aluminum, Copper, Titanium, SiO2, SiNx (K1c > 0.30)
- EMC / Underfill Applications: Significantly boosts interfacial bond strength to Epoxy Molding Compounds
- Thermal Processing: Hot plate bake (≥75°C~100°C) improves AFM uniformity and preserves adhesion over 7+ days
- Silane Concentration: 0.24 ~ 0.36% (1-methoxy-2-propanol solution)
AP8000 (Organosilane Primer)
- Compatible Substrates: Specialized ultra-pure primer for Oxide (SiO2) and Inorganic Glass surfaces
- Glass Packaging Applications: Strengthens epoxy molding adhesion on glass core and wafer-level packages
- Silane Concentration: 0.096 ~ 0.144% (Ultra-low concentration precision solution)
- Usage Note: Use AP3000 for Aluminum/metal substrates; AP8000 is optimized for glass and oxide dielectrics
Table 1. Adhesion Promoter Sales Specifications & Impurity Limits
| Property / Item | AP3000 | AP8000 | Notes |
|---|---|---|---|
| Silane Concentration | 0.24 - 0.36 % | 0.096 - 0.144 % | Ultra-pure pre-diluted solution |
| Particles (≥ 0.5 µm) | Max 25 counts/mL | Max 25 counts/mL | Semiconductor cleanroom grade |
| Individual Metallic Impurities | Max 1 ppm each | Max 1 ppm each | Na, K, Cu, Fe, Ni monitored |
| Total Metallic Impurities | Max 10 ppm | Max 10 ppm | High reliability packaging assurance |
| Shelf Life | 2 Years (Ambient) | 2 Years (Ambient) | Sealed room temperature storage |
EMC & Underfill Delamination Prevention
In high-density packaging, thermal expansion mismatch (CTE mismatch) causes severe interfacial shear stresses. By creating robust Si-O-Si and organofunctional covalent bonds, AP3000/AP8000 eliminates package delamination and moisture ingress at EMC and underfill interfaces.
Technical Inquiry & Sample Request: Adhesion Promoter (AP3000/8000)
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